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HomeTechnologyComputerNon-Silicone Thermal Paste 2.6 W/mK 30ml, NSP25 Grease, Thermal Gel Between Liquid...

Non-Silicone Thermal Paste 2.6 W/mK 30ml, NSP25 Grease, Thermal Gel Between Liquid and Solid State, Heat Sink Cooling, for Electronic Components PC Laptop/GPU/CPU


Price: $84.91
(as of Aug 21, 2022 08:20:54 UTC – Details)



Specification: Thermal Conductivity: 2.6 W/mK Viscosity @0.5rpm: 5000 Pas Density: 2.6 g/cm^3 Working Temperature: -50~150℃ Volume Resistance: 1×10^14 *Syringe should be used with glue gun Application: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board, Power Supply, Heat Sink, LCD-TV, Notebook, PC, Telecom Device, Wireless Hub, DDR ll Module, etc.
Silicone free thermal gel
Shapeable and compressible
Low thermal resistance
No fluidity
Best for north bridge IC

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